Part Number Hot Search : 
SSD50N10 MC333 SFS1001G BU252 2N6286E3 472M0 2N700207 AP40N03S
Product Description
Full Text Search
 

To Download PD3S023008 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 PD3S0230
SURFACE MOUNT SCHOTTKY BARRIER DIODE PowerDI(R)323
Please click here to visit our online spice models database.
Features
* * * * * * * Low Forward Voltage Drop Fast Switching Ultra-Small Surface Mount Package PN Junction Guard Ring for Transient and ESD Protection Lead Free Finish/RoHS Compliant (Note 1) "Green" Molding Compound (No Br, Sb) Ultra-Small Surface Mount Package
Mechanical Data
* * * * * * * * Case: PowerDI(R)323 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020D Terminals: Matte Tin Finish annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 Polarity: Cathode Band Marking Information: See Page 3 Ordering Information: See Page 3 Weight: 0.005 grams (approximate)
Top View
Maximum Ratings
@TA = 25C unless otherwise specified Symbol VRRM VRWM VR VR(RMS) IFM IFRM IFSM Value 30 21 200 300 600 Unit V V mA mA mA
Characteristic Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Continuous Forward Current Repetitive Peak Forward Current Non-Repetitive Peak Forward Surge Current @ tp < 10ms
Thermal Characteristics
Characteristic Thermal Resistance, Junction to Ambient Air (Note 2) Operating Temperature Range Storage Temperature Range Symbol RJA TJ TSTG Value 242 -65 to +125 -65 to +150 Unit C/W C C
Electrical Characteristics
Characteristic Reverse Breakdown Voltage (Note 3)
@TA = 25C unless otherwise specified Symbol V(BR)R Min 30 Typ 217 280 350 400 485 10.7 Max 240 320 400 500 800 2.0 5.0 Unit V Test Condition IRS = 100A IF = 0.1mA IF = 1mA IF = 10mA IF = 30mA IF = 100mA VR = 25V VR = 1.0V, f = 1.0MHz IF = 10mA through IR = 10mA to IR = 1.0mA, RL = 100
Forward Voltage
VF IR CT trr
mV
Leakage Current (Note 3) Total Capacitance Reverse Recovery Time
Notes:

A pF ns
1. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7. 2. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. TA = 25C. 3. Short duration pulse test used to minimize self-heating effect.
PowerDI is a registered trademark of Diodes Incorporated. 1 of 3 PD3S0230
Document number: DS30722 Rev. 7 - 2
July 2008
(c) Diodes Incorporated
www.diodes.com
PD3S0230
IF, INSTANTANEOUS FORWARD CURRENT (A)
IR, INSTANTANEOUS REVERSE CURRENT (uA)
10,000
100
1,000
10
1
100
0.1
10
0.01
1
0.001
0.1
0
1 1.2 1.4 1.6 0.2 0.4 0.6 0.8 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 1 Typical Forward Characteristics
0.0001 0
20 10 30 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 2 Typical Reverse Characteristics
20 18 CT, TOTAL CAPACITANCE (pF) 16 14 12 10 8 6 4 2 0 30 10 5 15 20 25 VR, DC REVERSE VOLTAGE (V) Fig. 3 Total Capacitance vs. Reverse Voltage
0.25
IF, DC FORWARD CURRENT (A)
0.2
0.1
0
0
25 75 100 125 50 TA, AMBIENT TEMPERATURE (C) Fig. 4 DC Forward Current Derating
150
175 TA, DERATED AMBIENT TEMPERATURE (C)
PF, FORWARD POWER DISSIPATION (W)
0.6
IPK =1(DC) IAV
150
0.5
125
0.4
100
0.3
75
0.2
50
0.1
25
0
10
20
30
0 0 0.6 0.4 0.2 IF, FORWARD CURRENT (A) Fig. 6 Forward Power Dissipation 0.8
VR, DC REVERSE VOLTAGE (V) Fig. 5 Operating Temperature Derating
Notes:
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
PowerDI is a registered trademark of Diodes Incorporated. 2 of 3 PD3S0230
Document number: DS30722 Rev. 7 - 2
July 2008
(c) Diodes Incorporated
www.diodes.com
PD3S0230 Ordering Information
Part Number PDS3S0230-7
Notes:
(Note 5) Case PowerDI 323
(R)
Packaging 3000/Tape & Reel
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
36
36 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: T = 2006) M = Month (ex: 9 = September)
Date Code Key Year Code Month Code
2006 T Jan 1
2007
2008 V Mar 3 Apr 4
YM
2009 W May 5
2010 X Jun 6
2011 Y Jul 7
2012 Z Aug 8 Sep 9
2013 A Oct O
2014 B Nov N
2015 C Dec D
Feb 2
Package Outline Dimensions
B C E
(R)
D H L L1
E
L2
PowerDI 123 Dim Min Max Typ A 3.50 3.90 3.70 B 2.60 3.00 2.80 C 1.63 1.93 1.78 D 0.93 1.00 0.98 E 0.85 1.25 1.00 H 0.15 0.25 0.20 L 0.55 0.75 0.65 L1 1.80 2.20 2.00 L2 0.95 1.25 1.10 All Dimensions in mm
A
Suggested Pad Layout
X1 G X2
Dimensions G X1 X2 Y1 Y2 Value (in mm) 1.0 2.2 0.9 1.4 1.4
Y2
Y1
IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.
PowerDI is a registered trademark of Diodes Incorporated. 3 of 3 PD3S0230
Document number: DS30722 Rev. 7 - 2
July 2008
(c) Diodes Incorporated
www.diodes.com


▲Up To Search▲   

 
Price & Availability of PD3S023008

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X